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Double-Sided Flexible Printing Membrane Printed FPC Circuit

Double-Sided Flexible Printing Membrane Printed FPC Circuit

  • বিশেষভাবে তুলে ধরা

    double-sided FPC circuit membrane

    ,

    flexible printing membrane switch

    ,

    printed FPC circuit switch

  • মডেল নং
    HC-FPC-002
  • কম্বিনেশন মোড
    আঠালো নমনীয় প্লেট
  • পরিবাহী আঠালো
    পরিবাহী সিলভার পেস্ট
  • শিখা প্রতিরোধক
    এইচবি
  • প্রক্রিয়াকরণ প্রযুক্তি
    ইলেক্ট্রোলাইটিক ফয়েল
  • বেস উপাদান
    অ্যালুমিনিয়াম
  • নিরোধক উপকরণ
    জৈব রজন
  • গড় বেধ
    1.1-0। আমি
  • কপার ফয়েল টাইপ
    ইলেক্ট্রোলাইটিক এবং ঘূর্ণিত
  • কপার ফয়েল পুরুত্ব
    1oz, 1/2oz, 1/3oz
  • সাবস্ট্রেট ফিল্ম বেধ
    1মিল, 1/2মিল
  • কভার ফিল্ম বেধ
    1মিল, 1/2মিল
  • স্টিফেনার পুরুত্ব
    3মিল থেকে 9মিলিল
  • উৎপাদন ক্ষমতা
    100,000 পিসি/মাস
  • এইচএস কোড
    8536500000
  • ন্যূনতম চাহিদার পরিমাণ
    100

Double-Sided Flexible Printing Membrane Printed FPC Circuit

Double-Sided Flexible Printing Membrane Printed FPC Circuit
Double-sided flexible printed circuit (FPC) boards offer exceptional flexibility and reliability for advanced electronic applications requiring compact, lightweight solutions.
Key Features and Benefits
  • Exceptional Flexibility: Can be bent, folded, and deformed freely with small coil radius and movement along X, Y, Z axes
  • Space-Saving Design: Light and thin construction (average thickness 1.1-0.1mm) maximizes use of narrow instrument spaces
  • Lightweight Construction: Optimized for current load rather than mechanical strength, resulting in minimal weight
  • Superior Sealing Capability: Designed for low-tensile seal performance in adverse environments
  • Stable Signal Transmission: Freely designed wiring patterns and conductor distances ensure steady RLC parameters
  • Easy Assembly: Excellent terminal properties for soldering, inserting, riveting, and gluing applications
  • Enhanced Insulation: Materials like polyimide and polyester provide superior insulation properties
Material Composition
Copper Foil Substrate:
  • Copper Foil: Electrolytic copper and rolled copper (common thickness: 1oz, 1/2oz, 1/3oz)
  • Substrate Film: Common thickness of 1mil and 1/2mil
  • Adhesive: Thickness customized to customer requirements
Cover Film Protection:
  • Cover Film: Surface insulation (common thickness: 1mil and 1/2mil)
  • Adhesive: Thickness customized to customer requirements
  • Prevents adhesive buildup and foreign matter before pressing
Stiffener (PI Stiffener Film):
  • Reinforces mechanical strength for surface mounting
  • Common thickness: 3mil to 9mil
  • Adhesive: Thickness customized to customer requirements
EMI Shielding: Electromagnetic shielding film protects circuit board lines from external interference in high electromagnetic environments.
Competitive Advantages
  • Shorter Assembly Time: Complete line configuration eliminates extra PCB wiring connection work
  • Compact Size: Small volume PCB effectively reduces product dimensions
  • Lightweight: Significantly lighter than traditional rigid PCBs
  • Thin Profile: Thinner than hard PCB boards, improving flexibility and 3D assembly capabilities
  • Quick Delivery
  • Premium Services
  • OEM/ODM Customization Available
Application Images
Double-Sided Flexible Printing Membrane Printed FPC Circuit 0 Double-Sided Flexible Printing Membrane Printed FPC Circuit 1 Double-Sided Flexible Printing Membrane Printed FPC Circuit 2 Double-Sided Flexible Printing Membrane Printed FPC Circuit 3 Double-Sided Flexible Printing Membrane Printed FPC Circuit 4